IEC 60191-5:1997 pdf download – Mechanical standardizationof semiconductor devices -Part 5: Recommendations applying to integrated circuit packages using tape automated bonding (TAB).
This part of IEC 60191 on mechanical standardization gives recommendations applying to integrated circuits supplied in packages using tape automated bonding (TAB) as the principal component for structural and interconnection funct,ons. This standard Is applicable to the finished component supplied by a manufacturer to a user and does not define requirements relating to the IC to tape interface (the inner lead bond or ILB).
2 Terms and definitions
For the purpose of this part of IEC 60191. the following definitions apply.
2.1 chIp (or dl.): A portion of a silicon wafer which contains at least one integrated circuit which has been separated from the waler containing an array of such devices.
2.2 tap. carrier1): A linear strip of a laminate of an insulating material and a conducting material patterned so as to mechanically support and electrically contact a chip. The strip may contain a series of such patterns and each such pattern is a tape site.
2.3 sprocket hole: A row ot holes on each side of the tape carrier used for driving the tape through equipment or for coarse alignment.
2.4 lead pattern: The pattern of etched conductive material on a tape carrier including the Inner and outer leads and the test pads.
2.5 Inner lead: The extreme Interior end of the lead pattern conductor which is used for connection to a chip
2.6 device window: A perforation at the centre of a tape site within which the chip and the inner leads are located.
2.7 outer lead or excise window: A rectangular perforation on each side of the tape site over which the conductor pattern is suspended. These perforations may form a continuous opening around the tape site, The bonded circuit is normally excised from the tape by cutting in this opening.
2.8 support ring: The portion of the Insulating film which supports the conductor pattern between the device window and the outer lead window.
2.9 body size: The outside dimension of the support ring.
This part of IEC 60191 on mechanical standardization gives recommendations applying to integrated circuits supplied in packages using tape automated bonding (TAB) as the principal component for structural and interconnection funct,ons. This standard Is applicable to the finished component supplied by a manufacturer to a user and does not define requirements relating to the IC to tape interface (the inner lead bond or ILB).
2 Terms and definitions
For the purpose of this part of IEC 60191. the following definitions apply.
2.1 chIp (or dl.): A portion of a silicon wafer which contains at least one integrated circuit which has been separated from the waler containing an array of such devices.
2.2 tap. carrier1): A linear strip of a laminate of an insulating material and a conducting material patterned so as to mechanically support and electrically contact a chip. The strip may contain a series of such patterns and each such pattern is a tape site.
2.3 sprocket hole: A row ot holes on each side of the tape carrier used for driving the tape through equipment or for coarse alignment.
2.4 lead pattern: The pattern of etched conductive material on a tape carrier including the Inner and outer leads and the test pads.
2.5 Inner lead: The extreme Interior end of the lead pattern conductor which is used for connection to a chip
2.6 device window: A perforation at the centre of a tape site within which the chip and the inner leads are located.
2.7 outer lead or excise window: A rectangular perforation on each side of the tape site over which the conductor pattern is suspended. These perforations may form a continuous opening around the tape site, The bonded circuit is normally excised from the tape by cutting in this opening.
2.8 support ring: The portion of the Insulating film which supports the conductor pattern between the device window and the outer lead window.
2.9 body size: The outside dimension of the support ring.
IEC 60191-5:1997 pdf download – Mechanical standardizationof semiconductor devices -Part 5: Recommendations applying to integrated circuit packages using tape automated bonding (TAB)
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