IEC 60319:1999 pdf download – Presentation and specification of reliability data for electronic components

IEC 60319:1999 pdf download – Presentation and specification of reliability data for electronic components.
IEC 60319 gives guidance for the collection and presentation of data necessary to understand the reliability characteristics of a component. It also gives guidance to component users as to how they should specify their reliability requirements to component manufacturers. It makes no distinction between data on failures or operation without failures or faults.
Such factual information, derived from laboratory tests, should be available to the circuit and equipment designers to enable evaluation of the reliability of circuits and systems.
2 NormatIve references
The following normative documents contain provisions which, through reference In this text, constitute provisions of this International Standard. For dated references, subsequent amendment to or revisions of any of these publications do not apply. However, parties to agreements based on this International Standard are encouraged to investigate the possibility of applying the most recent editions of the normative documents indicated below. For undated references, the latest edition of the normative document referred to applies. Members of IEC and ISO maintain registers of currently valid International Standards.
IEC 60050(191 ):1 990. International Electrotechnical Vocabulary (1EV) — Chapter 191:
Dependability and quality of service
IEC 61 3604:1 997. Standard data element types with associated classification scheme for electric components — Part 4: IEC reference collection of standard data element types, component classes and terms
3 DefinitIons
For the purposes of Ihs International Standard. the terms and definitions of IEC 60050(191) apply.
4 Requirements for presenting reliability data
4.1 General
Where possible, information should be obtained by the use of standard reliability tests. However, If some of the required data do not exist then steps should be taken to obtain them by the use of dedicated tests.
If this is not possible, then generic estimates or data trom equivalent devices may be used assuming that this Is stated In the data presentation.
The following or similar data should be supplied by the component manufacturer or requested by the component user: component identification, component technology, electrical specification, environmental specification, methods for selection ot sample components, test related issues, data on failures.
4.2 IdentificatIon of components tested
4.2.1 General
The information supplied to identify the components should be in accordance with the relevant IEC publication for the component type under test whenever possible. If IEC publications are not available, then other component specifications should be used and the source of the specifications stated. As a minimum, the following information should be given. Only information applicable to a particular component type should be supplied
4.2.2 Component Identification
a) A description of the component type with sufficient details to uniquely identify the component type, for example N-channel V-MOS transistor. When available, specification numbers should be given.
b) The component part number, If available, a universal part number, for example stock number, should be given; otherwise a part number specific to the component manulacturer may be given.
C) Name of the manufacturer and place of manufacture. The purpose of these references is to allow access to more detailed information If required.
d) The date of manufacture or lot number or other production batch related identification. This information will allow access to other components that were produced at the same time as the sample should a problem arise.
e) The production status of the component, for example development sample, pre-production, standard production, mature technology.
f) Information regarding compliance with other recognized standards should be given whenever possible.
4.3 Component technology
a) A description of the basic component technology, for example metal film resistor.
b) A general description DI the production process. for example ion beam epetaxy.
c) Packaging Information, for example plastic, hermetic weld. etc.
d) Thermal resistance, for example Rthl.5, h.I.c’
e) Complexity of circuit.
I) Method of termination, for example endcaps, OIL, SUD.