IEC 61163-2:1998 pdf download – Reliability stress screening -Part 2: Electronic components

IEC 61163-2:1998 pdf download – Reliability stress screening -Part 2: Electronic components.
This part of IEC 61163 provides guidance on reliability stress screening techniques and procedures for electronic components This standard is not, and cannot be. exhaustive due to the rapid rate of developments in the electronics industry.
This standard is intended for the use of
a) component manufacturers as a guideline.
b) component users as a guideline to negotiate with component manufacturers on stress screening requirements or plan a stress screening process in house due to reliability requirements.
c) subcontractors who provide stress screening as a service.
This standard is not intended to provide test plans for specific electronic components or for delivery of certificates of conformance for batches of components.
2 Normative references
The following normative documents contain provisions which, through reference in this text, constitute provisions of this part of IEC 61163. At the time of publication, the editions indicated were valid. All normative documents are subject to revision, and parties to agreements based on this part of IEC 61163 are encouraged to investigate the possibility of applying the most recent editions of the normative documents indicated below. Members of lEG and ISO maintain registers of currently valid International Standards.
lEG 60050(191 ):1990, International Eleclrotechnical Vocabulary (1EV) — Chapter 191:
Dependability and quahty of service
IEC 60300.1.1993, Dependability management – Part 1. Dependability programme management
IEC 60300•2:1 995, Dependability management Part 2: Dependability programme elements and tasks
IEC 60300-3-7:—, Dependability management — Part 3-7: Application guide — Reliability stress screening of electronic hardware 1)
IEC 61163-1:1995, Reliability stress screening — Part 1: Repairable items manufactured in tots
lEG 61709:1996. Electronic components — Reliability — Relerence conditions for failure rates and stress models for conversion
3 DefInitions
For the purpose of this part of IEC 61163, the following definitions as well as those given in
IEC 60050(191) and IEC 60300-3-7 apply:
3.1
reliability screening (process)
a process of detection of flaws and removal and repair of weak items for I he purpose of
reaching as rapidly as possible the reliability level expected during the useful life
NOTE I — IEC 60050(1911 defines in 191-17-02, the term aum-in This term, however, Is used by many manufacturers to describe a so-called ‘soaktest’. which a Only one of many possible ways of screening. Furthermore ‘burn-In’ may include ag.mg, the purpose of stiech I, to stabilize parameters, and where m many cases no failures occur.
NOTE 2 — IEC 6O0Of 191) defines, in 191-14-09. the terni •screenlng tear. This term, however, Is d.tined too broadly to be applicable In me present context because it encompasses screening 0 any types Of non-conformItIes. Furlh.rmore. reliability screening is a process, met a test.
NOTE 3 — Repair Is not applicable In the case of electronic components.
3.2
reliabIlIty stress screening (process)
a process using environmental andlor operational stress as a means of detecting flaws by
precipitating them as detectable failures
NOTE — Reliability screening Is designed wIth the intention ot preclpltabng flaws Into detectable failures. An ageing process designed specifically with the Intention of stabilizing parameters is not a reliability stress screening process and w ttierelore outside the scope of this standard,
3.3
weak Item
an item which has a high probability of failure in the early failure period due to a flaw (see also 3.8: earty failure period)
3.4
weakness
any imperfection (known or unknown) in an item, capable of causing one or more weakness failures
NOTE I — Each type of weakness is assumed to be statistically independent of all other such types NOTE 2 — A weakness may be either inherent o Induced.
3.5
weakness failure
a failure due to a weakness in the item itself when sublected to stresses within the stated
capabilities of the item [IEV 191 -04-06)
3.6
flaw
a weakness in an item which gives rise to early weakness failures
3.7
inherent flaw
a flaw in an Item related to its technology and manufacturing process.