IEC 61751:1998 pdf download - Laser modules usedfor telecommunication -Reliability assessment

IEC 61751:1998 pdf download – Laser modules usedfor telecommunication -Reliability assessment

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IEC 61751:1998 pdf download – Laser modules usedfor telecommunication -Reliability assessment.
The aim of this standard is
— to establish a standard method of assessing the reliability of laser modules in order to minimize risks and to promote product development and reliability:
— to establish means by which the distribution of failures with time can be determined. This should enable the determination of equipment failure rates for specified end of life criteria.
In addition, guidance is given on:
— the testing that a system supplier should ensure is In a place prior to procurement of a laser module from a laser module manufacturer;
— a range of activities expected of a System supplier to verify a laser module manufacturers reliability claims.
Further details concerning the rationale are given in annexes A and B.
2 Normative references
The following normative documents contain provisions which, through reference in this text, constitute provisions of this International Standard, At the time of publication, the editions indicated were valid. All normative documents are subject to revision, and parties to agreements based on this International Standard are encouraged to investigate the possibility of applying the most recent editions of the normative documents indicated below, Members of IEC and ISO maintain registers of currently valid International Standards.
IEC 60068•2-1 :1990. Environmental testvng — Part 2: Tests. Tests A: Cold
lEG 60068-2.14:1984. Environmental testing – Part 2: Tests. Test N: Change of temperature
IEC 60747.1:1996, SemIconductor devices — Discrete devices and integrated circuits — Part 1:
General
Amendment 3 (1996)
IEC 60747-12-2:1995. Semiconductor devices — Part 1 2: Opto&ectronic devices — Section 2:
Blank detail specit,ca lion for laser diode modules with pigta,l for fibre optic systems and sub• systems
lEG 60749:1996, Semiconductor devices — Mechanical and climatic test methods ISO 9000: Quality management and quality assurance standards
MIL-STD-883:1985, Test methods and Procedures for Microelectronics
3 Terms and definitions
For the purpose of this International Standard the folIowng definitions apply:
laser module
a packaged assembly containing a laser diode and photodiode
NOTE — The inoOLse may also Include a cooler and temperatur, sensor to enabl, laser temperature to be controlled and monitored The oillcal output ‘a normally via an oØiceA tibre pigtail.
submount
a substrate upon which a laser diode or photodiode may be mounted for assembly into the laser module
NOTE — Components on submounts a’. also subiecl to qual,ticalon testing.
laser module manufacturer (LMM)
a manufacturer of laser modules who provides devices meeting the requirements of the relevant detail specification (DS) and the customer’s reliability requirements
system supplier (SS)
a manulacturor of telecommunications,’data transmission equipment containing optoelectronic semiconductor lasers. i.e. laser module customer
system operator (SO)
a network operator of telecommunications/data transmission equipment containing optoelectronic semiconductor lasers In the transmission path
NOTE — The system may also be pail of other more ertensive systems. br esamole lelecomnlunecations. rail, road VeliiclC5, arrospace or wpuns.
capability qualifying components (CQC)
components selected to represent critical stages of the process and limiting or boundary characteristics of mechanical and electro-optic design
Such components should aid the identification of end product failure mechanisms to enable the determination of activation energies.
4 Laser reliability and quality assurance procedure
4.1 DemonstratIon of product quality
This standard (where required by the detail specification (OS)) gives the minimum mandatory requirements and is part of a total laser reliability and quality assurance procedure adopted by the laser module manufacture,
It gives guidance on the activities of the system supplier, and the system operator as well as feedback of field performance, the laser module manufacturer and the system supplier.

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